N. Guo-quan: search on Z-Library

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1

Fight against corruption: The common mission for developing countries

Journal:

Journal of Zhejiang University SCIENCE A

Year:

2001

Language:

english

File:

PDF, 468 KB

english, 2001

2

Fujianese Pioneers and Javanese Kings: Peranakan Chinese Lineage and the Politics of Belonging in West Java, 1890s–2000s

Journal:

Year:

2017

Language:

english

File:

PDF, 1.32 MB

english, 2017

3

Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

Zhang, Z., Guo-Quan Lu

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2002

Language:

english

File:

PDF, 934 KB

english, 2002

4

The Gender Politics of Confucian Family Law: Contracts, Credit, and Creole Chinese Bilateral Kinship in Dutch Colonial Java (1850s–1900)

Journal:

Comparative Studies in Society and History

Year:

2018

Language:

english

File:

PDF, 228 KB

english, 2018

5

Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices

Bai, John G., Calata, Jesus N., Lu, Guo-Quan

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 1.23 MB

english, 2007

6

Stacked solder bumping technology for improved solder joint reliability

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A Dillard

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 1013 KB

english, 2001

7

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Application of Nano Silver sintering technique on the chip bonding for flip-chip and vertical light emitting diodes

Tao, Mian, Mei, Yun-Hui, Lee, S. W. Ricky, Yun, Feng, Lu, Guo-Quan

Year:

2016

Language:

english

File:

PDF, 988 KB

english, 2016

8

Effect of substrate flexibility on solder joint reliability

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A Dillard

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 543 KB

english, 2002

9

Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste

Zheng, Hanguang, Berry, David, Calata, Jesus N., Ngo, Khai D. T., Luo, Susan, Lu, Guo-Quan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 11.62 MB

english, 2013

10

Chip-scale packaging of power devices and its application in integrated power electronics modules

Xingsheng Liu,, Xiukuan Jing,, Guo-Quan Lu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 847 KB

english, 2001

11

Feature extraction for rolling element bearing fault diagnosis utilizing generalized S transform and two-dimensional non-negative matrix factorization

Bing Li, Pei-lin Zhang, Dong-sheng Liu, Shuang-shan Mi, Guo-quan Ren, Hao Tian

Journal:

Journal of Sound and Vibration

Year:

2011

Language:

english

File:

PDF, 2.02 MB

english, 2011

12

Revolutionary Cosmopolitanism and its Limits

Seng (æå½æ³), Guo-Quan

Journal:

Journal of Chinese Overseas

Year:

2020

File:

PDF, 1.11 MB

2020

13

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area Chips

Lei, T.G., Calata, J.N., Guo-Quan Lu, Xu Chen, Shufang Luo

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 1.64 MB

english, 2010

14

Rolling manipulation

Journal:

Journal of Acupuncture and Tuina Science

Year:

2003

Language:

english

File:

PDF, 178 KB

english, 2003

15

Thermal management of power electronics modules packaged by a stacked-plate technique

Shatil Haque, William A. Stinnett, Douglas J. Nelson, Guo-Quan Lu

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 477 KB

english, 1999

16

Chamaechromone, a novel rearranged biflavonoid from Stellera chamaejasme L.

Masatake Niwa, Guo-Quan Liu, Hiroshi Tatematsu, Yoshimasa Hirata

Journal:

Tetrahedron Letters

Year:

1984

Language:

english

File:

PDF, 214 KB

english, 1984

17

Technology trends toward a system-in-a-module in power electronics

Lee, F.C., van Wyk, J.D., Boroyevich, D., Guo-Quan Lu,, Zhenxian Liang,, Barbosa, P.

Journal:

IEEE Circuits and Systems Magazine

Year:

2002

Language:

english

File:

PDF, 657 KB

english, 2002

18

[IEEE 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - Tampa, FL, USA (2017.3.26-2017.3.30)] 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - A phase-leg IGBT module using DBC substrate without Ag finish by pressureless sintering of nanosilver paste

Yan, Haidong, Mei, Yunhui, Li, Xin, Chen, Gang, Lu, Guo-Quan

Year:

2017

Language:

english

File:

PDF, 3.81 MB

english, 2017

19

The physiological responses of carnation cut flowers to exogenous nitric oxide

Chang-li Zeng, Li Liu, Guo-quan Xu

Journal:

Scientia Horticulturae

Year:

2011

Language:

english

File:

PDF, 308 KB

english, 2011

20

Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Paste/Bare Cu)

Zhao, Su-Yan, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 3.21 MB

english, 2016

21

Characterization of interfacial thermal resistance by acoustic micrography imaging

Shatil Haque, Guo-Quan Lu, J. Goings, J. Sigmund

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 1.79 MB

english, 2000

22

Effects of device passivation materials on solderable metallization of IGBTs

Shatil Haque, Guo-Quan Lu

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 251 KB

english, 2001

23

Thermo-Mechanical Reliability of Double-Sided IGBT Assembly Bonded by Sintered Nanosilver

Mei, Yun-Hui, Lian, Jiao-Yuan, Chen, Xu, Chen, Gang, Li, Xin, Lu, Guo-Quan

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.68 MB

english, 2014

24

Effects of solder joint shape and height on thermal fatigue lifetime

Xingsheng Liu,, Guo-Quan Lu,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 2.30 MB

english, 2003

25

Short-Term Wind Power Prediction Based on Improved Chicken Algorithm Optimization Support Vector Machine

Fu, Chao, Li, Guo-Quan, Lin, Kuo-Ping, Zhang, Hui-Juan

Journal:

Year:

2019

Language:

english

File:

PDF, 1.46 MB

english, 2019

26

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Tan, Yansong, Li, Xin, Chen, Xu, Yang, Zhenwen, Lu, Guo-Quan

Journal:

Soldering & Surface Mount Technology

Year:

2019

File:

PDF, 2.01 MB

2019

27

Simplification of the Nanosilver Sintering Process for Large-Area Semiconductor Chip Bonding: Reduction of Hot-Pressing Temperature Below 200/spl deg/C

Kewei Xiao,, Calata, Jesus N., Hanguang Zheng,, Ngo, Khai D. T., Guo-Quan Lu,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 8.50 MB

english, 2013

28

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - “Low-temperature sintering of nanosilver paste for lead-free chip attach”

Year:

2012

Language:

english

File:

PDF, 232 KB

english, 2012

29

[IEEE 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Cincinnati, OH (2017.10.1-2017.10.5)] 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Bonding of large substrates by silver sintering and characterization of the interface thermal resistance

Gao, Shan, Yang, Zhenwen, Tan, Yansong, Li, Xin, Chen, Xu, Sun, Zhan, Lu, Guo-Quan

Year:

2017

Language:

english

File:

PDF, 450 KB

english, 2017

30

Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Xu Chen, Y.C. Lin, Xingsheng Liu, Guo-Quan Lu

Journal:

Engineering Fracture Mechanics

Year:

2005

Language:

english

File:

PDF, 629 KB

english, 2005

31

Design issues of a three-dimensional packaging scheme for power modules

Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dusan Boroyevich, Guo-Quan Lu

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 641 KB

english, 2001

32

Vibrating manipulation

Journal:

Journal of Acupuncture and Tuina Science

Year:

2003

Language:

english

File:

PDF, 274 KB

english, 2003

33

Cytotoxic activity of the alkaloids from Broussonetia papyrifera fruits

Pang, Su-Qiu, Wang, Guo-Quan, Lin, Jun-sheng, Diao, Yong, Xu, Rui-an

Journal:

Pharmaceutical Biology

Year:

2014

Language:

english

File:

PDF, 577 KB

english, 2014

34

Improved Nonlinear Equation Method for Numerical Prediction of Jominy End-Quench Curves

Yue-peng SONG, Guo-quan LIU, Sheng-xin LIU, Jian-tao LIU, Cheng-ming FENG

Journal:

Journal of Iron and Steel Research, International

Year:

2007

Language:

english

File:

PDF, 363 KB

english, 2007

35

High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

Bai, John Guofeng, Yin, Jian, Zhang, Zhiye, Lu, Guo-Quan, van Wyk, Jacobus Daniel

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.15 MB

english, 2007

36

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Haque, S., Kun Xing,, Ray-Lee Lin,, Suchicital, C.T.A., Guo-Quan Lu,, Nelson, D.J., Borojevic, D., Lee, F.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 501 KB

english, 1999

37

Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate

Zhao, Su-Yan, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 3.63 MB

english, 2015

38

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

Bai, J.G., Zhiye Zach Zhang, Calata, J.N., Guo-Quan Lu

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2006

Language:

english

File:

PDF, 1.13 MB

english, 2006

39

Controllable optical rogue waves in the femtosecond regime

Dai, Chao-Qing, Zhou, Guo-Quan, Zhang, Jie-Fang

Journal:

Physical Review E

Year:

2012

Language:

english

File:

PDF, 4.59 MB

english, 2012

40

Flip-chip on flex integrated power electronics modules for high-density power integration

Bai, J.G., Guo-Quan Lu,, Xingsheng Liu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 1003 KB

english, 2003

41

Orbital angular momentum density and spiral spectra of Lorentz–Gauss vortex beams passing through a single slit

Ji, Zhi-Yue, Zhou, Guo-Quan

Journal:

Chinese Physics B

Year:

2017

Language:

english

File:

PDF, 2.98 MB

english, 2017

42

A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air

Li, Jie, Li, Xin, Wang, Lei, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Materials & Design

Year:

2018

Language:

english

File:

PDF, 1.82 MB

english, 2018

43

Magneto-optical current sensing for applications in integrated power electronics modules

John G. Bai, Guo-Quan Lu, Tao Lin

Journal:

Sensors and Actuators A: Physical

Year:

2003

Language:

english

File:

PDF, 483 KB

english, 2003

44

Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5$\,\times\,$5-${\rm mm}^{2}$ Chip Attachment

Gang Chen,, Yunjiao Cao,, Yunhui Mei,, Dan Han,, Guo-Quan Lu,, Xu Chen,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.96 MB

english, 2012

45

Nerve Growth Factor-β Expression Is Associated with Lymph Node Metastasis and Nerve Infiltration in Human Hilar Cholangiocarcinoma

Lei-bo Xu, Chao Liu, Guo-quan Gao, Xian-huan Yu, Rui Zhang, Jie Wang

Journal:

World Journal of Surgery

Year:

2010

Language:

english

File:

PDF, 401 KB

english, 2010

46

Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging

Fu, Shancan, Mei, Yunhui, Li, Xin, Ning, Puqi, Lu, Guo-Quan

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 2.42 MB

english, 2015

47

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

Y.C. Lin, X. Chen, Xingsheng Liu, Guo-Quan Lu

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 658 KB

english, 2005

48

Spatial network analysis of carbon emissions from the electricity sector in China

He, Yang-Yang, Wei, Zhen-Xiang, Liu, Guo-Quan, Zhou, P.

Journal:

Journal of Cleaner Production

Year:

2020

File:

PDF, 2.45 MB

2020

49

Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers

Wang, Meiyu, Mei, Yunhui, Liu, Wen, Xie, Yijing, Fu, Shancan, Li, Xin, Lu, Guo-Quan

Journal:

IEEE Journal of Emerging and Selected Topics in Power Electronics

Year:

2019

Language:

english

File:

PDF, 7.20 MB

english, 2019

50

Circular-rubbing manipulation

Journal:

Journal of Acupuncture and Tuina Science

Year:

2003

Language:

english

File:

PDF, 271 KB

english, 2003

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